04.06.2015

Power packaging dallas tx

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WESTERVILLE, Ohio (April 17, 2012) – Power Packaging, an Exel company, has received the Copacker Above and Beyond Award for Innovation and Productivity from its customer, PepsiCo.
PepsiCo and Power Packaging have a strong history of working together on dry and liquid production dating back to the mid-1980s, including being the source of important innovation launches such as Tropicana 10oz, G2 and Propel® powders, and several packaging innovations. PepsiCo will present the award to Power Packaging at its facility in Grand Prairie, Texas, on Tuesday, April 24.
PepsiCo is a global food and beverage leader with net revenues of more than $65 billion and a product portfolio that includes 22 brands that generate more than $1 billion each in annual retail sales.
Packaging provides customers with a wide range of solutions including comprehensive contract packaging, and integrated value-added and specialist services. Exel is the North American leader in contract logistics, providing customer-focused solutions to a wide range of industries including automotive, consumer, retail, engineering and manufacturing, life sciences and healthcare, technology, energy and chemicals.
BevNET Beverage School is an on-demand, video-based learning tool and online community designed for entrepreneurs and newcomers to the food and beverage industry.
Published 8x per year, BevNET Magazine is the leading industry magazine for analysis of trends, innovation, marketing, and product development.
All components in contact direct with the product are made of stainless steel or food sanitary standards. Applicable packing products : powders, granules, tablets…etc, such as sugar, salt, tea, beans, medicine, health foods, melon seeds, pepper, instant juice powder…etc. Optional Equipment : Automatic Date coder, easy opening device, product input equipment, product out put conveyor.
We have more than 30 years machine manufacture experiences and selling packaging machines to worldwide around 90 countries.
Power electronics packaging plays an inportant role in the design of semiconductor devices and systems. Disc and stud thyristors with ceramic caps represent excellent examples of hermetic air tight packages made of ceramic and metals.


Another important aspect of packaging technology is the selection of material to use for the substrate.
A number of ceramics provide a high degree of insulation abilities and good thermal conductivity. Diamond is an exception among insulating materials since its thermal conductivity is approximately 5 times higher than copper. The thermal coefficient of expansion of the DBC is similar to the thermal coefficients of expansion of Al2O3 and Si. An Insulated metallic substrate (IMS) is essentially a doped polymer covered on one or both sides by a thin copper layer. As opposed to DBC substrates, IMS substrates offer flexibility and can be adapted for use in smaller quantities. Semikron - who has written 189 posts on PowerGuru – Power Electronics Information Portal. We have nearly a half-century of food manufacturing expertise, the long-term stability to drive innovation, and the supply chain sophistication required by our customers. Our customers compete on a global scale launching and producing some of the world’s most popular brands. The award singles out Power Packaging, one of 64 PepsiCo copackers, for consistently providing significant value through the most innovative product and packaging solutions while delivering outstanding production results. Today, Power Packaging supports PepsiCo at all three of its multi-customer dry facilities as the only copacker for the entire line of G, G2, Propel® and G Series Pro powders. The packaging technologies used in the production of power electronics components largely determine the electrical, thermal, and mechanical properties of the resulting device. At the junction of the ceramic and the metal, the ceramic is metallized using screen printing technology.
Many options are available and selection largely guided by the thermal requirements of the application.
In the production of DBC substrates, an Al2O3 ceramic is coverd with this liquid and upon solidification, deep and strong bonds are formed between the copper and the ceramic.


The temperature resistance is relatively high but decreases as the metal layer thickness is increased.
IMS substrates have relatively high coefficients of thermal expansion and thus limited temperature stability and cycle life, while the coefficients of thermal expansion in DBCs are similar to silicon.
They depend on us to provide food and liquid beverage manufacturing and packaging services that adhere to the strictest quality and safety standards.
PepsiCo’s people are united by our unique commitment to sustainable growth by investing in a healthier future for people and our planet, which we believe also means a more successful future for PepsiCo. Innovations include production of the first stick pack, introduction of paperboard aseptic packaging to the U.S.
Glass-metal housings are often used in hybrid circuits for aerospace and similar applications which require high levels of reliability. Non-oxide ceramics such as AIN have to be oxidised on the surface before they can be used to create DBCs. General applications of IMS include use in power conversion, motor drivers, solid state relays, welding machines, uninterruptible power supplies, among others. From procurement of raw materials through manufacture and distribution – we put trust on the shelves. This article provides several examples and comparisons of packaging technologies commonly used in today's power electronics market. The production of ceramic discs is done via sintering of ceramic powder at high temperatures while adding small amounts of sintering aid (for example Yttrium oxide, Y2O3) . The table below shows a comparison of the most important properties of insulating materials as well as silicon.



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